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Hesse & Knipps Wedge Bonder Improves Cost-of-Ownership
Added: (Mon May 05 2008)
Hesse & Knipps, leading manufacturer of high-speed fine pitch wedge bonders for the back-end semiconductor industry, will be demonstrating the capabilities of the BONDJET BJ820 at the upcoming International Microwave Symposium in booth 1149 on June 15 20 in Atlanta, GA. The BONDJET BJ820 is a high-speed fully automatic wedge bonder that offers the flexibility for both high-speed round wire and deep access ribbon and wire bonding. It handles all challenging fine pitch wire bonding applications in a single platform - including RF and microwave devices, COB, MCM and hybrids, fiber optics and automotive - using aluminum or gold wire or ribbon up to 6 wires/second. The looping profiles and height consistencies offered by the BONDJET BJB20 meet and exceed RF/Microwave Market expectations.
With high repeatability of 1ėm at a balanced encoder resolution of 20nm, the BJ820 BONDJET offers increased process stability that enables reliable bonding of extremely small bond pads with a larger wire diameter. An efficient 12 x 16.1 work area can serve as two or more smaller stations for efficient handling of smaller products or substrates. Coupled with intelligent automation solutions, these features eliminate significant indexing time, resulting in 60% greater throughput than competing machines.
The BONDJET BJ820 offers very high repeatability for high volume production environments and a large control work area for both wire and ribbon bonding, offering greater throughput than competitive technology, notes Joseph Bubel, President, Hesse & Knipps, Inc. It offers a cost effective alternative for ribbon bonding, which is gaining greater popularity for use in high frequency electronics within the microwave market.
Other significant machine capabilities include:
· 12.5ėm to 85ėm diameter wire bonding
· Ribbon bonding from 6ėm x 35ėm to 25ėm x 250ėm
· Constant loop height and wire length
· Maintains parallel loops within mixed reference system
· Auto teach for linear applications, reducing programming time
With a footprint of only 720 x 1250 mm, the BONDJET BJ820 can be easily integrated into existing floor plan configurations or new concepts. For more information on the BONDJET BJ820, email us at info@hesse-knipps.us or refer to our web site at http://www.hesse-knipps.com/index.php?myELEMENT=Bondjet+BJ820+Beschreibung
About Hesse & Knipps
Hesse & Knipps GmbH Semiconductor Equipment, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The companys automatic wedge bonders handle aluminum and gold wire in round and ribbon wire configurations with solutions for both light and heavy wire applications ranging from 12.5 micron (.0005) to 500 microns (.020) wire diameters. The companys product line also includes dispensers and ultrasonic flip chip bonders, standard or customized indexers and handling systems, and process and manufacturing monitoring systems for interfacing with the companys equipment and commercial software packages.