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Aries Electronics’ New High-Frequency Center Probe Test Socket Ideal for Devices up to 13 mm sq.
Added: (Thu Jan 31 2008)
Bristol, Pa. January 2008 – Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, today announced its new high-frequency center probe test socket for devices up to 13 mm sq. Available in four versions with ratings of 1-3 GHz, 3-5 GHz, 5-9 GHz and 10-18 GHz, the new socket is ideal for manual, high-speed testing of devices such as CSP, mBGA, DSP, LGA, SRAM, DRAM and Flash, with pitches as low as 0.40 mm.
The socket’s solderless, pressure-mount, compression spring probes allow the socket to be easily mounted to and removed from the test board. The four-point crown ensures “scrub” on solder balls for reliable contact mating and its raised tip probe works with LGAs, MLFs and other socket types. The socket’s gold-over-nickel compression spring probe screws leave very small witness marks on the bottom of the device solder balls and are accurately located by two molded plastic alignment pins and secured with four stainless steel screws.
Aries’ new socket provides minimal signal loss for higher bandwidth capability via a signal path of only 0.077” (1.95 mm). With an overall size of 1.200" (30.48 mm) x .840" (21.34 mm) x .440" (11.18 mm), the socket provides the maximum allowable space for board components and connectors.
The compression spring probes in Aries’ new RF sockets are constructed of durable heat-treated Beryllium-Copper alloy, plated with 30 m min. (0.75 µm) gold per Mil-G-45204 over 30 µ" min. (0.75 µm) nickel per QQ-N-290. The socket’s molded components are UL 94 V-0 PEEK or Ultem. All hardware is stainless steel.
The socket’s contact forces are 16 g per contact on a 0.50 mm pitch, 25 g per contact on a 0.50-0.75 mm pitch and 25 g per contact on 0.80 mm or larger pitch. Operating temperature is -55°C to 150°C (-67°F to 302°F) and estimated contact life is more than 500,000 cycles.
Pricing for a center probe test socket with up to 50 positions starts at $330 in single piece quantities. Delivery is four to six weeks ARO.
For additional information, contact Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810; Tel: 215-781-9956; Fax: 215-781-9845; Email: info@arieselec.com;
Web: www.arieselec.com, Data sheet #24008. www.arieselec.com/products/24008.pdf.
Europe Email: europe@arieselec.com.
For an electronic copy, please visit http://www.simongroup.com/PressRoom/WordDocs/ari/ARI-A-7371.doc.
For high res photo, please visit
http://www.simongroup.com/PressRoom/Images/aries/ARI-A-7371.jpg.
For additional news releases from Aries Electronics, please visit http://www.simongroup.com/PressRoom/aries.html.
READER SERVICE INQUIRIES: Please forward all reader service inquiries to Frank Folmsbee, Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810.
UPCOMING TRADESHOW: BiTS, Mesa, Arizona, March 9-12 2008.
EDITORS NOTE: Headquartered in Bristol, Pa., Aries Electronics Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip™ product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.