Bharatbook.com: Evolving High Speed Connectors
Added: (Tue Sep 08 2009)
Pressbox (Press Release) -
Connectors designed to operate in multi-gigabit applications have proliferated over the past four years providing system designers greatly expanded interconnect options and performance levels. Advances in connector as well as signal conditioning technology have pushed interface bandwidth from 3 Gb/s to 20+ Gb/s, with at least one supplier introducing a 40 Gb backplane connector. This market research report addresses the many aspects of the high-speed interconnect market from what is driving demand for faster channels, to defining the key characteristics of the leading connector families that are currently available. Detailed market estimates and forecasts extending to 2013 for backplane and cable connectors by application and region of the world are featured. (http://www.bharatbook.com/Market-Research-Reports/Evolving-High-Speed-Connectors.html)
A variety of factors associated with high-speed channels have a major influence on their behavior. Chapters are devoted to reviewing related system elements including driver and receiver technology, printed circuit board materials, as well as channel modeling, and performance measurement systems.
A new chapter focused on innovation provides examples of new creative approaches to addressing some of the challenges associated with interconnection and packaging of next generation electronic equipment.
This market research report also includes several tutorial chapters on connector and high-speed design issues that enable a non-technical reader to gain from the information provided.
Technology
Bandwidth demands are increasing resulting in greater challenges to satisfying signal integrity requirements. At the same time packaging density puts more contacts in closer proximity to each other creating potential for increased crosstalk and signal degradation.
Systems consume more power that generates more heat. Connectors must be designed to support power / thermal management schemes.
Emerging standards such as the Intel Quick-Path Interconnect are driving changes in both current as well as future high-speed connectors and have implications for every element in the channel.
High-speed copper cable assemblies that incorporate passive or active equalization techniques are expanding the anticipated practical bandwidth and length limitations of just a few years ago.
Designing 6 Gb/s channels is not a trivial issue, causing engineers to rely on their chosen connector vendor to provide extensive selection and design support 24/7 on a global basis.
Connector manufacturers are working closely with suppliers of driver and receiver chips to demonstrate performance in faster and longer channels.
For more information please visit: http://www.bharatbook.com/Market-Research-Reports/Evolving-High-Speed-Connectors.html
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